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Huynh, Thi; Weiss, Florian; Nguyen, Thi; Reckien, Werner; Bredow, Thomas; Fluegel, Alexander; Arnold, Marco; Mayer, Dieter; Keller, Hubert; Broekmann, Peter (2013). On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica acta, 89, pp. 537-548. Elsevier Science 10.1016/j.electacta.2012.10.152
Saracino, Martino; Broekmann, Peter; Gentz, Knut; Becker, Moritz; Keller, Hubert; Janetzko, Florian; Bredow, Thomas; Wandelt, Klaus; Dosch, Helmut (2009). Surface relaxation phenomena at electrified interfaces: revealing adsorbate, potential and solvent effects by combined x-ray diffraction, STM and DFT studies. Physical review. B - condensed matter and materials physics, 79(11), p. 115448. Ridge, N.Y.: American Physical Society 10.1103/PhysRevB.79.115448
